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Product Design |
PCB Design |
SI & Thermal |
Reliability Analysis |
FPGA Design |
Embedded Software |
Re-Engineering Services |
Automotive Electronics Design |
Circuit Design |
Analog PCB Design |
Outsource PCB Design Services
High speed PCB designs,High speed digital, Analog, mixed digital/analog, RF designs, Power supply.
High Layer count (30 layers), Ultra High density designs.
Impedance controlled Designs with delay matching, Stack-up and material selection.
Wireless LAN:802.11X,802,15.4Fine pitch BGA (0.4mm) with high pin count (1512).
Designs with Micro Vias, Blind Vias, Buried Vias and backdrill.
Motherboards, Single Board computers, High speed Serial Backplanes, Telecom Backplane.
ASIC Test Boards, Load Boards, Probe Cards, Burn-in Boards, sockets, Package Design.
Standards Compliant (IPC, UL, MIL, DO-254) designs.
High speed interconnects till 10Gbps.
Pre-Route and post-route Signal Integrity Analysis, IBIS Model Creation.
EMI analysis, Power Integrity analysis.
Signal quality analysis:Cross talk,Reflections, Timing, Eye diagram,Bit error rate.
Board and system Level Thermal Design, simulation and analysis, Multi-board analysis.
Design for Testability (DFT), Manufacturability (DFM) and serviceability.
Mechanically and Thermally constrained PCB's.
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India - Hyderabad, Bangalore, Chennai, Pune, Delhi, Mumbai
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